New wafer-level-packaging technology using silicon-via-contacts for optical and other sensor applications

Wafer-level-packaging has been proven in numerous applications as the optimal packaging solution for microelectronic devices. In the field of sensors and MEMS, packaging cost is still the major expense factor. In this paper, a new packaging technology, which is a combination of wafer-level-packaging (WLP) and MEMS processing technology is presented. With a strong focus on optical applications, the basic processing steps to form a unique wafer-level-package for sensor and MEMS devices is discussed.