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Challenges of small form factor 0402 and 0201 die side capacitor assembly process on high density interconnect flip chip substrate

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4 Author(s)
Loke, C.C. ; Assembly Technol. Dev., Intel Technol. (M) Sdn Bhd, Penang, Malaysia ; Chin-Thong Cheong ; Hun-Song Goh ; Amir Nur Rashid Wagiman

This paper summarizes all the challenges in enabling the low cost high volume manufacturing (HVM) process to attach "ultra mini" 0201/0402 die side capacitors (DSC) onto a small form factor high density interconnect (HDI) flip chip substrate. The key focus areas are on the optimum DSC pad design, stencil design, paste printing, capacitor terminal control and component pickup accuracy.

Published in:

Electronic Components and Technology Conference, 2004. Proceedings. 54th  (Volume:1 )

Date of Conference:

1-4 June 2004

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