By Topic

Challenges in accelerated life testing

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
P. Lall ; Dept. of Mech. Eng., Auburn Univ., AL, USA

Accelerated testing typically targets-life estimation and defect or design weakness identification. The intent is to obtain more information from a given test time than would normally be possible. Time compression is typically achieved by acceleration of single or combination of stresses- temperature, vibration, humidity, etc. Short product development schedule, time-to-market requirements and the development timeline often dictate a fixed time under test. In a test-to-fixed life approach, given number of the product are tested to a fixed life, with zero failures allowed. The test demonstrates the product's minimum reliability, while allowing for a fixed time to conduct testing. In absence of life-test information, the challenge is to decipher if the product may be over-designed or marginally designed. Failure mechanisms and modes observed in accelerated test may not be observed in field life. Accelerated tests such as thermal shock from -55 to 125°C may stress the material beyond the equipment operating range, such as above glass transition temperature, where material properties may be significantly different. In general, failure mechanisms may be accelerated by a various forms of temperature stresses including temperature cycle, time dependent temperature change and spatial gradient of temperature or non-temperature stresses including humidity, shock and vibration. Variability of field use conditions often make the task of developing correlations more difficult.

Published in:

Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on  (Volume:2 )

Date of Conference:

1-4 June 2004