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Lead-free 95.5Sn-3.8Ag-0.7Cu solder joint reliability analysis for micro-BGA assembly

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3 Author(s)
Pang, J.H.L. ; Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore ; Low, P.T.H. ; Xiong, B.S.

A design-for-reliability methodology was applied to a micro-BGA assembly with lead-free, 95.5Sn-3.8Ag-0.7Cu solder joints. A rate dependent viscoplastic Anand model was curve fitted from a series of constant strain rate tensile test and creep test results. The material parameters for the viscoplastic Anand model for 95.5Sn-3.8Ag-0.7Cu solder was implemented in finite element analysis. Low cycle isothermal fatigue test was conducted over three frequencies of 1 Hz, 0.01 Hz and 0.001 Hz; three temperatures of 25°C, 75°C and 125°C; and four total strain range values of 2, 3.5, 5, and 7.5% respectively. A micro-BGA assembly with lead-free, 95.5Sn-3.8Ag-0.7Cu solder joints was subjected to (-55 to 125°C) thermal cycling test and the Weibull distribution was obtained. FEA modeling and simulation was employed to predict the fatigue life cycles of the micro-BGA package and compared to the MTTF life cycles.

Published in:

Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on  (Volume:2 )

Date of Conference:

1-4 June 2004