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Electromigration reliability enhancement of flip chip interconnects using Cu-doped SnPb solder

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4 Author(s)
Wu, J.D. ; Stress & Reliability Lab., Adv. Semicond. Eng., Inc., Kaohsiung, Taiwan ; Lee, C.W. ; Wu, S.Y. ; Li, S.

This work investigates electromigration resistance of three solder bump compositions, i.e. Sn63Pb37, SnPbCu, and SnPbNi. FCBGA with Cu-doped SnPb interconnects are observed to have 3.5-fold improvement in characteristic life (t63) than that of FCBGA using eutectic SnPb solder. On the other hand, significant reliability degradation (55%) is obtained when employing Ni-doped SnPb solder.

Published in:

Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International

Date of Conference:

25-29 April 2004