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This work investigates electromigration resistance of three solder bump compositions, i.e. Sn63Pb37, SnPbCu, and SnPbNi. FCBGA with Cu-doped SnPb interconnects are observed to have 3.5-fold improvement in characteristic life (t63) than that of FCBGA using eutectic SnPb solder. On the other hand, significant reliability degradation (55%) is obtained when employing Ni-doped SnPb solder.