By Topic

SMT solder joint's shape and location optimization using genetic algorithm with neural networks in high acceleration condition

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Qiang Guo ; State Key Lab. of Vibration Shock & Noise, Shanghai Jiaotong Univ., China ; Mei Zhao ; Lingyun Wei

There have many papers in shape optimization of comparatively poor in adaptability to environment and in SMT solder joint. But there have little paper to consider location optimization of SMT solder joint. And in dynamic high acceleration load, the location of SMT solder joint is so important that can impact its reliability and lifetime seriously. In this paper, SMT solder joint's shape and location optimization using neural network based on genetic algorithm in dynamic high acceleration load is considered and some satisfactory results are obtained. Among the optimization, there is a fact that the location of solder joint is the first factor under mechanical condition while under thermal condition, the shape of solder joint is the first factor to reliability of solder joint.

Published in:

Microelectronics, 2004. 24th International Conference on  (Volume:2 )

Date of Conference:

16-19 May 2004