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Integration challenges of new materials and device architectures for IC applications

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39 Author(s)
Nguyen, Bich-yen ; Freescale Semicond., Technol. Solutions Organ., Austin, TX, USA ; Thean, Aaron ; White, Ted ; Vandooren, A.
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In this paper, we will detail the issues with new materials being introduced into CMOS devices and present some potential solutions to enable high performance and low power CMOS for the 65nm node and beyond.

Published in:

Integrated Circuit Design and Technology, 2004. ICICDT '04. International Conference on

Date of Conference:

2004