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Improved yields for the nano-technology era using cryogenic aerosols

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2 Author(s)
Wagener, T.J. ; FSI Intl. Inc., Chaska, MN, USA ; Kawaguchi, K.

In this paper, cryogenic aerosol processing for enhancing final device yield in state-of-art 180 and 130 nm devices is demonstrated. Significant advantages of this particle removal technology is demonstrated and discussed: excellent particle removal efficiency on both hydrophilic and hydrophobic surfaces, no watermarks, no feature damage, no charge induced damage and no film modification or loss.

Published in:

Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop

Date of Conference:

4-6 May 2004