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Advanced Process Control (APC) and Advanced Equipment Control (AEC) which has come to the foreground with current design nodes is expected that the 65nm node requires implementation of both. The main goal has been to improve overall fab efficiency (OEF) with better tool utilization. This paper has described the necessary aspects of process control to reduce variance by utilizing the tool-level data for both AEC and APC that were available with leading edge etch systems. In terms of AEC, the tool-level data can be analyzed for various important applications including chamber baselining, chamber matching, process monitoring, wafer state monitoring and process optimization. With regards to APC the use of tool-level metrology and process information can be used to control and improve the on-wafer performance and to achieve the tight tolerances for advanced fabrication.