Referenced Items are not available for this document.
In this paper the challenges of incorporating in-line FIB as process monitor is discussed, for both process qualification phase as well as production phase. Results of advanced FIB capabilities using Applied's SEMVision G2FIB is demonstrated on some of Infineon's most challenging process steps, previously lacking in-line capability. In addition, the efforts and results of developing best known methods (BKMs) for FIB milling, deposition techniques (capping) and imaging is discussed and shown comparing results to traditional lab profile measurement techniques.
Published in:
Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
Date of Conference: 4-6 May 2004
- Page(s):
- 140 - 143
- Print ISBN:
- 0-7803-8312-5
- INSPEC Accession Number:
- 8065888
- Digital Object Identifier :
- 10.1109/ASMC.2004.1309552
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