By Topic

Optimization of thermal interface materials for electronics cooling applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Vishal Singhal ; Sch. of Mech. Eng., Purdue Univ., West Lafayette, IN, USA ; Siegmund, T. ; Garimella, Suresh V.

Thermal interface materials (TIMs) are used in electronics cooling applications to decrease the thermal contact resistance between surfaces in contact. A methodology to determine the optimal volume fraction of filler particles in TIMs for minimizing the thermal contact resistance is presented. The method uses finite element analysis to solve the coupled thermo-mechanical problem. It is shown that there exists an optimal filler volume fraction which depends not only on the distribution of the filler particles in a TIM but also on the thickness of the TIM layer, the contact pressure and the shape and the size of the filler particles. A contact resistance alleviation factor is defined to quantify the effect of these parameters on the contact conductance with the use of TIMs. For the filler and matrix materials considered-platelet-shaped boron nitride filler particles in a silicone matrix-the maximum observed enhancement in contact conductance with the use of TIMs was by a factor of as much as nine.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:27 ,  Issue: 2 )