By Topic

Photoresist coating methods for the integration of novel 3-D RF microstructures

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Nga Phuong Pham ; Lab. of Electron. Components, Delft Univ. of Technol., Netherlands ; Boellaard, E. ; Burghartz, J.N. ; Sarro, P.M.

This paper presents three coating methods of photoresist on large three-dimensional (3-D) topography surfaces. Two special methods, spray and electrodeposition (ED) are introduced and investigated for the fabrication of 3-D microstructures and RF-MEMS devices. Characteristics of each method as well as its advantage and disadvantages are outlined. A comparison is made to point out the most suitable coating method in terms of complexity, performance and type of application. The potential of these coating methods is demonstrated through several applications such as fabrication of multilevel micromachined structures and RF MEMS devices.

Published in:

Microelectromechanical Systems, Journal of  (Volume:13 ,  Issue: 3 )