By Topic

Patterned electroplating of micrometer scale magnetic structures on glass substrates

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
de Vries, A.H.B. ; Inst. for Biomed. Technol., Univ. of Twente, Enschede, Netherlands ; Kanger, J.S. ; Krenn, B.E. ; van Driel, R.

This paper has developed a new method of micro patterned electroplating that enables the fabrication of micrometer scale magnetic structures on glass substrates. In contrast to other methods, the process as developed here leaves the surrounding substrate area untouched: that is there is no seed layer present except underneath the magnetic structures. Patterned cobalt layers of thicknesses up to 8 μm were fabricated exhibiting high saturation (1.5 T) and low coercive force. These layers have been used to create micrometer scale magnetic poles (magnetic tweezers) for biological and biophysical applications, where a clean untouched glass substrate in the sample area is most important. The technique, however, can be used in any situation where a residual seed layer on the surrounding area is unwanted, and afterwards removal of this seed layer is difficult or impossible.

Published in:

Microelectromechanical Systems, Journal of  (Volume:13 ,  Issue: 3 )