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Using a hybrid approach to evaluate semiconductor life cycle environmental issues - a case study in interconnect module impacts

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6 Author(s)
Krishnan, N. ; Mech. Eng., California Univ., Berkeley, CA, USA ; Boyd, S. ; Rosales, J. ; Dornfeld, D.
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A methodology to perform a hybrid approach to evaluate semiconductor life cycle impacts is developed. This methodology uses (i) bottom-up process models and data to develop inventories for semiconductor manufacturing, and for specialty semiconductor chemicals items and (ii) an economic input-output method for generic inventory items. The approach attempts to overcome several semiconductor LCA (life cycle assessment) challenges and is illustrated through a case study in life cycle environmental impacts of an interconnect module in a logic device.

Published in:

Electronics and the Environment, 2004. Conference Record. 2004 IEEE International Symposium on

Date of Conference:

10-13 May 2004