Using a hybrid approach to evaluate semiconductor life cycle environmental issues - a case study in interconnect module impacts

A methodology to perform a hybrid approach to evaluate semiconductor life cycle impacts is developed. This methodology uses (i) bottom-up process models and data to develop inventories for semiconductor manufacturing, and for specialty semiconductor chemicals items and (ii) an economic input-output method for generic inventory items. The approach attempts to overcome several semiconductor LCA (life cycle assessment) challenges and is illustrated through a case study in life cycle environmental impacts of an interconnect module in a logic device.