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RF SiP technology innovation through integration

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4 Author(s)
Jianhua Wu ; Anadigics Inc., Warren, NJ, USA ; Anderson, M.J. ; Coller, D. ; Guth, G.

System-in-package (SiP) products have been growing rapidly in recent years as an alternative to system-on-chip (SoC) products. As a packaging technology platform, SiP allows a high degree of flexibility in package architecture, particularly for RF applications. RF SiP is a powerful packaging platform for wireless communication and data access and enables the integration of digital ICs, logic ICs and RFICs into a compact RF system or sub-system within a single module format using state-of-the-art technology converged from IC packaging and SMT assembly. In this paper, the trends of wireless access and mobile networking technologies are reviewed. Technical challenges and constraints to wireless systems for handset and mobile access appliances are discussed. The packaging technology choice, performance and cost trade-offs are presented using RF SiP as a packaging platform. Finally, a novel SiP scenario is presented, which aims to provide an innovative solution through integration to help meet the demands of miniaturization, performance and cost for wireless handset and other mobile products.

Published in:

Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on

Date of Conference:

28-30 Oct. 2003