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Non-hermetic opto-electronic packaging, coupled with passive coupling, provides the direction for reducing the cost of automating packaging and assembly processes, without sacrificing the overall reliability. In this paper, we discuss the process of establishing the platform for the first time in China, which includes the material selection and evaluation, process development that includes silicon bench micro-machining and solder pad metallization, solder film deposition, laser diode bonding, UV-curing, matching fluid dispensing, glob-top encapsulation, and silicon bench bonding on the board. Numerical and experimental tools are used for the optical, thermal, and mechanical performance of the packaging design and manufacturing. In particular, Monte Carlo simulation was used to predict that 100% can be achieved when the flip-chip post-bonding accuracy can be maintained to be within 2 /spl mu/m in in the plane direction and 1 /spl mu/m in the out-of-plane displacement control. Results for an innovative MiniDIL TOSA/ROSA and a transceiver module are discussed.