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Study on simulation-based optimization for flip chip package parameters by using RSM analysis and Ant algorithm

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4 Author(s)
Quanyong Li ; Center of Micro-electric Package & Assembly Technol., Guilin Univ. of E1ectronic Technol., China ; Yubing Gong ; Daoguo Yang ; Junsheng Liang

In this paper, a simulation-based optimization methodology combining the Response Surface Method (RSM) and a newly developed Ant Algorithm is introduced. An approximate function between the chief packaging parameters and the maximum value of the equivalent stress in the solder joints has been built. Finally, the better solution of the chief packaging parameters is obtained from Ant Algorithm.

Published in:

Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on

Date of Conference:

28-30 Oct. 2003