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Modeling and analysis of a new product development in electronic sub-assembly manufacturing

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3 Author(s)
Joseph, L.A. ; Digital Equipment Corp., Tewksbury, MA, USA ; Watt, J.T. ; Wigglesworth, N.

The authors discuss the use of simulation modeling in the analysis of a process technology in electronic subassembly manufacturing to support the formulation of assembly, test, and repair strategy for volume manufacturing. The emphasis of the model is on the performance of the process from a capacity and quality standpoint. The study highlights the impact of defects (material and process) in parts per million, and manufacturing process strategy on throughput, work in process, cycle time, process yield, and defect escapes. A modular approach to simulation modeling is described. In this approach, users specify the characteristics (e.g., repair time) of a particular process step at a high level within the modular code. The modular code then translates this characteristic into the simulation code needed to represent that characteristic. The modular approach allows for quick and easy model development without repetitive code writing

Published in:

Simulation Conference, 1990. Proceedings., Winter

Date of Conference:

9-12 Dec 1990