Close category search window
 

Numerical simulations of scattering from multilayers separated by one-dimensional rough interfaces

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Dechamps, N. ; CNRS, Ecole Polytechnique de l''Universite de Nantes, France ; Bourlier, C. ; de Beaucoudrey, N. ; Toutain, S.

The problem of electromagnetic wave scattering by a stack of two-dimensional Gaussian rough interfaces is solved. The scattered field is expressed from the Kirchhoff approximation where the multiple scattering phenomenon is neglected and the average field (bistatic scattering coefficient) is computed from a Monte Carlo method. The advantage of this method is that it is fast unlike the exact numerical methods as method of moments. The two rough interfaces separate three lossless and homogeneous media. The bistatic scattered field and the scattering cross section are derived in this paper for vertical and horizontal polarizations. The application of this work is the study of electromagnetic modeling of oil slicks on ocean surfaces.

Published in:
Geoscience and Remote Sensing Symposium, 2003. IGARSS '03. Proceedings. 2003 IEEE International  (Volume:1 )

Date of Conference: 21-25 July 2003

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.