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Lead free solder paste containing SnAgBiIn alloy: a preliminary study

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2 Author(s)
Liu, Y. ; Kester, Litton Components Pte Ltd, Singapore, Singapore ; Wang, X.B.

In this report, a preliminary investigation has been conducted on some lead free solder pastes containing Sn88Ag3.5Bi0.5In8 alloy. The wetting performances of these solder pastes on different substrates were studied under various reflow profiles. The test results of solder ball, slump and printing properties indicate that with a proper paste flux vehicle, lead free solder paste using Sn88Ag3.5Bi0.5In8 alloy may achieve a good performance.

Published in:

Asian Green Electronics, 2004. AGEC. Proceedings of 2004 International IEEE Conference on the

Date of Conference:

2004