By Topic

Realization and thermal analysis of silicon thermal spreaders used in power electronics cooling

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Ivanova, M. ; Lab. d''Electrotech. de Grenoble, ENSIEG, St. Martin d''Heres, France ; Schaeffer, C. ; Avenas, Y. ; Lai, A.
more authors

Currently the thermal losses of power electronic devices are increasing. At the same time, their sizes are decreasing. Consequently heat sinks have to dissipate very large heat flux densities. Heat pipes are very effective heat transfer devices and can be used to raise the thermal conductive path in order to spread a concentrated heat source over a much larger surface area. As a result, the high heat flux at the heat source can be reduced to a much smaller and manageable level that can be dissipated through conventional cooling methods. At the first part of this paper we present the silicon heat spreader structure. Then an analytical model of heat pipe limits is described and finally an experimental study and test results are presented in order to show the interests of heat pipes in power electronics cooling.

Published in:

Industrial Technology, 2003 IEEE International Conference on  (Volume:2 )

Date of Conference:

10-12 Dec. 2003