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The characterisation of planar electroplated NiW micro springs for temporary connection of Flip Chips is presented. Four micro spring types with different properties were designed. FEM-analysis was used to simulate the spring characteristics for a force of 20 mN at a vertical displacement up to 50 μm. Micro springs were fabricated using electroplating of NiW and a sacrificial copper layer etching process. Three versions of elliptically shaped contacts elements with self-alignment capabilities for Flip Chip bumps were realised on top of the micro springs. At the required contact force of 20 mN a contact resistance of 400 mΩ was observed using a Au80Sn20 solder ball as a probe.