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A mold and transfer technique for lead-free fluxless soldering and application to wafer-level low-temperature thin-film packages

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2 Author(s)
Stark, B.H. ; Center for Wireless Integrated Microsyst., Michigan Univ., Ann Arbor, MI, USA ; Najafi, K.

This paper demonstrates a technique to pre-mold and transfer lead-free solder balls for MEMS/electronics packaging applications. A reusable bulk micromachined silicon wafer is used to mold a solder paste and remove excess flux prior to transfer to a host wafer that may contain released MEMS. This technique has been used to fabricate low temperature thin film vacuum packages. Long term (>5 months) reliability of these packages at room temperature and pressure is demonstrated through integrated Pirani gauges. Data from preliminary accelerated lifetime testing (thermal cycling and autoclave soaking) is also offered.

Published in:

Micro Electro Mechanical Systems, 2004. 17th IEEE International Conference on. (MEMS)

Date of Conference: