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Wafer-scale transducer arrays

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3 Author(s)
Chapman, G.H. ; Simon Fraser Univ., Burnaby, BC, Canada ; Parameswaran, M. ; Syrzycki, M.

The production of wafer-scale transducer arrays using laser interconnection techniques and micromatching technology is discussed. The design of a wafer-scale thermal dynamic scene simulator that was implemented using the laser-linking redundancy technique is presented to illustrate typical design requirements. The simulator uses small arrays of thermal pixels and control circuitry in 3 mu m CMOS technology.<>

Published in:

Computer  (Volume:25 ,  Issue: 4 )