Referenced Items are not available for this document.
Piezoresistive stress sensors are widely used to characterize semiconductor die stresses. Packaging stresses induce a small change in resistance in the sensors and they are highly sensitive to factors such as temperature and processing conditions. Thus, accurate stress prediction requires calibration and knowledge of all sources of variation in the resistance response of the sensors. This paper quantifies the effect of process variations and demonstrates that die level tracability is critical to ensure accurate stress prediction.
Published in:
Components and Packaging Technologies, IEEE Transactions on
(Volume:27
,
Issue:
1
)
Date of Publication: March 2004
- Page(s):
- 81 - 86
- ISSN :
- 1521-3331
- INSPEC Accession Number:
- 8090978
- Digital Object Identifier :
- 10.1109/TCAPT.2004.825761
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 19 April 2004
- Issue Date :
- March 2004
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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