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Effect of thermal cycling on the adhesion strength of Sn-9Zn-xAg-Cu interface

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4 Author(s)
Tao-Chih Chang ; Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Taiwan, Taiwan ; Min-Hsiung Hon ; Moo-Chin Wang ; Dong-Yih Lin

The effect of thermal cycling on the adhesion strength of the Sn-9Zn-xAg-Cu interface has been investigated by using pull-off tester, X-ray diffractometer, scanning electron microscope and energy dispersive spectrometer. The Sn-9Zn-xAg lead-free solders offer a better thermal cyclic resistance than the 63Sn-37Pb and Sn-9Zn solder alloys. The adhesion strength of the Sn-9Zn-Cu interface increases from 4.4 ± 0.4 MPa to 13.8 ± 0.9 MPa with increasing the thermal cycles from zero to three times but it decreases to 8.5 ± 0.8 MPa for five cycles. The Sn-9Zn-xAg solder alloys (x=0.5, 2.5, and 3.5 wt%) have a similar tendency and the maximum adhesion strength of 21.41 ± 1.5 MPa for the Sn-9Zn-2.5Ag solder alloy has been obtained after three thermal cycles. The adhesion strength of the Sn-9Zn-1.5Ag-Cu interface increases from 7.8 ± 0.6 to 16.6 ± 0.9 MPa with increasing the thermal cycles from 0 to 5 times.

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Advanced Packaging, IEEE Transactions on  (Volume:27 ,  Issue: 1 )