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Browse Journals & Magazines > Advanced Packaging, IEEE Tran ...> Volume:27 Issue:1 Help

Modeling, analysis and design of resonant free power distribution network for modern microprocessor systems

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1 Author(s)
Mandhana, O.P. ; Somerset Design Center, Motorola Corp., Austin, TX, USA

This paper presents design-oriented analysis of the power distribution network (PDN) for high performance microprocessor systems to realize the resonant free, close to flat output impedance magnitude over a wide frequency range. Based on the frequency domain analysis, closed form design equations and parametric curves relating the system parameters are derived. A systematic method of estimating the optimum parameters of the decoupling capacitors used in a single or multistage PDN is described to realize the output impedance of specified magnitude for the noise-free, and critically damped voltage at the microprocessor core. The design examples and simulation results are discussed to demonstrate the application of the design equations and parametric curves.

Published in:
Advanced Packaging, IEEE Transactions on  (Volume:27 ,  Issue: 1 )

Date of Publication: Feb. 2004

Page(s):
107 - 120
ISSN :
1521-3323
INSPEC Accession Number:
8090930
Digital Object Identifier :
10.1109/TADVP.2004.825376
Product Type:
Journals & Magazines
Date of Current Version :
19 April 2004
Issue Date :
Feb. 2004
Sponsored by :
IEEE Components, Packaging, and Manufacturing Technology Society

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