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A method to evaluate effects of moisture absorption on dielectric constant and dissipation factor of printed circuit board materials

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5 Author(s)
Heinola, J.-M. ; Lappeenranta Univ. of Technol., Finland ; Latti, K.-P. ; Silventoinen, P. ; Strom, J.-P.
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In this article a new method to evaluate, effects of moisture absorption on dielectric constant and dissipation factor in function of temperature and frequency are presented. The development of method is based on the experimental measurements and the use of ring resonator structures implemented to FR4-type material. The experimental measurement procedure was carried out at frequency range from 1 GHz to 10 GHz. The used temperature points were 23°C and 85°C. The results gained by the presented method were observed to be reproducible and consistent with the amount of the absorbed moisture. The method can be applied to different printed circuit board materials.

Published in:
Advanced Packaging Materials: Processes, Properties and Interfaces, 2004. Proceedings. 9th International Symposium on

Date of Conference: 2004

Page(s):
241 - 246
Print ISBN:
0-7803-8436-9
INSPEC Accession Number:
7939415
Digital Object Identifier :
10.1109/ISAPM.2004.1288020
Product Type:
Conference Publications

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