By Topic

Formulation of different shapes of nanoparticles and their incorporation into polymers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Pothukuchi, S. ; Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Yi Li ; Wong, C.P.

Shape controlling of nanoparticles is a very important aspect in nanotechnology. By controlling the particle sizes and shapes in the 1-100 nm range virtually all material properties can be controlled. The current work focuses on the synthesis of such nanoparticles and subsequent incorporation of the different shaped nanoparticles into epoxy matrix. The object of current interest is to evaluate the use of metal nanoparticles in polymer-metal composites. Of particular interest is the case where the first connected path of metal particles occurs across the sample, called the percolation threshold. There has been evidence of a giant increase in capacitance at room temperature just below the percolation threshold. The current work is an initial step to use the current developments in nanotechnology to incorporate various shaped fillers in polymer matrices. This can shed light on fundamental theory behind the dielectric properties of polymer-metal dielectrics. For the current work silver has been chosen as the metal and epoxy has been chosen as the polymer matrix. Nanocubes, spheres and wires have been synthesized by current and novel methods and incorporated into epoxy.

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 2004. Proceedings. 9th International Symposium on

Date of Conference:

2004