Cart (Loading....) | Create Account
Close category search window

Packaging of devices for topside cooling by replacing air-bridges with Su-8 polymer bridges [MESFET example]

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Wright, J.I. ; Gen. Electr. Global Res. & Dev. Center, Niskayuna, NY, USA ; Fillion, R. ; Meyer, L. ; Shaddock, D.

This paper takes an in-depth look at the qualifications of Su-8 photoresist as a low-k dielectric in the fabrication of integrated circuits (ICs). This paper discusses replacing air bridges on MESFET devices with polymer bridges fabricated from Su-8. This polymer bridge structure has several impacts for on-wafer processing as well as topside cooling packaging techniques for microwave devices. For on-wafer processing, replacing airbridges with polymer bridges eliminates the need for wafer thinning, through-wafer vias, and provides a dielectric interface material for Cu interconnects. Eliminating processing steps as well as the fragile topside air-bridge structures improves both the yield and the reliability. From a packaging perspective, fabricating polymer bridges allows further topside processing to take place in order to build packaging structures that can both remove the FET generated heat from the topside of the device as well as have access to the electrical I/Os.

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 2004. Proceedings. 9th International Symposium on

Date of Conference:


Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.