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High-speed system bus for a SoC network processing platform

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4 Author(s)
Bissou, J.P. ; Dept. of Electr. Eng., Ecole Polytech. Montreal, Que., Canada ; Dubois, M. ; Savaria, Y. ; Bois, G.

Interconnecting modules in a SoC platform requires modules compatibility. Several solutions are available, but they either lack the necessary throughput or the flexibility. This paper proposes an interconnection architecture for a flexible on-chip high-performance communication medium that can provide variable bandwidth. It is based on the AHB AMBA bus. The proposed architecture has been implemented in the Seamless environment and laid out using a 0.18 μm CMOS with Cadence tools to validate the proposed concept.

Published in:

Microelectronics, 2003. ICM 2003. Proceedings of the 15th International Conference on

Date of Conference:

9-11 Dec. 2003