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Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging

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6 Author(s)
Wunderle, B. ; Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin, Germany ; Auersperg, J. ; Grosser, V. ; Kaulfersch, E.
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A modular and parametric approach to FE-modelling is presented which allows rapid virtual prototyping for MEMS and other microelectronics packages with respect to some topical reliability issues: Thermal management and thermo-mechanical fatigue. Thereby the method of automatic model generation by modular parametric modelling is outlined and some examples featuring the required solution techniques are given. This simulation procedure forms part of a comprehensive design optimisation process in the field of predictive engineering.

Published in:

Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on

Date of Conference:

5-7 May 2003