IEEE.org| IEEE Xplore Digital Library| IEEE Standards| IEEE Spectrum| More Sites

Cart (Loading....) | Create Account | 

Close category search window
Author Searchbeta |  Advanced Search  |  Preferences |  Search Tips  |  More Search Options  
 
Browse Conference Publications > Design, Test, Integration and ... Help

SU8 resist plasma etching and its optimisation

Full Text Sign-In or Purchase

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing! close button
puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Guodong Hong ; Dept. of Electr. & Electron. Eng., Imperial Coll., London, UK ; Holmes, A.S. ; Heaton, M.E.

The thick photoresist SU8, by virtue of its good mechanical durability, water impermeability and dielectric properties on polymerisation, is widely used as a resin for making high aspect ratio, functional MEMS device structures and packaging parts. However, the difficulty associated with removal, stripping or repatterning of the polymerised SU8 remains a serious issue. This paper presents a novel process, based on O2/SF6 plasma etching, for patterning or removal of fully cross-linked SU8. The Taguchi methodology is used to optimise the O2/SF6 mix for a high etch rate and low under cut.

Published in:
Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on

Date of Conference: 5-7 May 2003

Page(s):
268 - 271
Print ISBN:
0-7803-7066-X
INSPEC Accession Number:
8454682
Digital Object Identifier :
10.1109/DTIP.2003.1287050

IEEE Account

Purchase Details

Profile Information

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.