By Topic

Soldered sealing process to assemble a protective cap for a MEMS CSP

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Jung, E. ; Fraunhofer-IZM, Berlin, Germany ; Ostmann, A. ; Wiemer, M. ; Kolesnik, I.
more authors

Capping and hermetic sealing of MEMS devices is a key factor in enabling them to be processed with further packaging steps like TO can, ceramic package or molded plastic. Aside from mounting a hermetic cap, the soldering of a front- and backside structured cap wafer allows as well to realize a chip scale package type of device protecting the internal MEMS structures and providing direct electrical interconnect structures for subsequent surface mount assembly, omitting additional packaging steps. In order to forego the cost and process issues around wafer feed through contacts, standard, established wire bond process is used to make a contact from the MEMS device to the backside structured cap wafer having a contact layer deposited on top. Solder balls terminate the electrical interconnects, allowing a seamless integration into a SMD compatible process. The paper presents the concept, the technical realization of this approach and the extension to a full wafer level chip scale MEMS package.

Published in:

Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on

Date of Conference:

5-7 May 2003