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This paper describes a wafer-to-wafer 0-level packaging method to realize low-profile, near hermetically sealed packaged devices using BenzoCycloButene (BCB) as the bonding and sealing material. The technique is fully described, and the bond is mechanically tested in terms of shear strength and hermeticity. Silicon caps as thin as 100 μm have been successfully bonded to silicon device wafers. Shear strength as high as 20 MPA have been measured, and all tested packaged devices were gross leak tight.