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Application of the "Multi Architecture Modeling" design method to system level MEMS simulation

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3 Author(s)
M. Schlegel ; Dept. of Electr. Eng. & Inf. Technol., Chemnitz Univ. of Technol., Germany ; G. Herrmann ; D. Muller

The paper is focussing on high abstraction level CAD modeling of MEMS using a new methodical approach called "Multi Architecture Modeling" which makes it possible to simulate models at different abstraction levels together. The paper presents the MAM method and its application to the design of the experimental prototype "vibration sensor array". This system consists of a micromechanical sensor (array of laterally moving mass-spring systems, fabricated by SCREAM technology, intended for low cost applications in wear state recognition), an environmental model for the sensor, analog and digital signal processing.

Published in:

Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on

Date of Conference:

5-7 May 2003