Cart (Loading....) | Create Account
Close category search window
 

A new computational method for piezoelectric plate modeling: application to membrane microsensors

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Ferrario, L. ; Microelectron. Div., ITC-irst, Trento, Italy ; Taschini, S. ; Emmenegger, M. ; Baltes, H.
more authors

Among applications of the piezoelectric effect in micro-electro-mechanical systems (MEMS), several employ membranes as the active region of the device. We have developed a new multilayered piezoelectric composite plate finite element that improves the modeling of piezoelectric membranes. In this paper we present the implementation of the element within the finite element package FEMEngine. We demonstrate the validity of the theory and use the implementation to simulate a viscosity sensor for food-stuff monitoring. Our work is motivated by the fact that the accurate modeling of piezoelectric multilayered membranes is not possible with currently available commercial finite element software.

Published in:

Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on

Date of Conference:

5-7 May 2003

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.