By Topic

High-performance inductors using capillary based fluidic self-assembly

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Scott, K.L. ; Hitachi GST Res. Div., San Jose Res. Center, CA, USA ; Hirano, T. ; Yang, H. ; Singh, H.
more authors

In this paper, a batch microfabrication process is presented for creating high aspect ratio, micron-sized helical and toroidal inductors with Q greater than or equal to 50 at multi-GHz frequencies. With a maximum processing temperature of only 220°C, the inductors can be fabricated on top of standard CMOS wafers. This process can also be used to create "inductor chiplets", which are polymer-encapsulated inductors with the same form factor as an EIA (Electronics Industries Association) standard 0201 surface mount device. The chiplets can be assembled onto CMOS wafers using a fluidic microassembly technique. This technique allows for multiple electrical interconnects to the inductor chiplets. The 40-μm gap between the substrate and assembled inductor increases the Q by a factor of ∼3 compared to as-fabricated inductors. Assembled and as-fabricated inductors have been characterized on similar substrates and have maximum Q values of 50 and 15 with resonant frequencies of 10 GHz and 9 GHz, respectively. Performance of the assembled inductors is nearly comparable to that of inductors as fabricated and tested on quartz substrates.

Published in:

Microelectromechanical Systems, Journal of  (Volume:13 ,  Issue: 2 )