Notification:
We are currently experiencing intermittent issues impacting performance. We apologize for the inconvenience.
By Topic

Stacked polymeric multimode waveguide arrays for two-dimensional optical interconnects

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Joon-Sung Kim ; Dept. of Mater. Sci. & Eng., Kwangju Inst. of Sci. & Technol., Gwangju, South Korea ; Kim, Jang-Joo

Two-dimensional (2-D) polymeric multimode waveguide arrays with two reflection-mirrors have been fabricated for optical interconnects between 2-D arrayed vertical-cavity surface-emitting lasers and detectors. Contact printing lithography was adopted for simple and low-cost process using ultraviolet-curable epoxy-based polymers. Fabricated waveguides were diced of the same size and stacked one by one with lateral positional errors less than ±20 μm. Two kinds of mirrors were fabricated: single-reflection mirror and double-reflection mirror. Double-reflected mirrors resulted in lower losses with 1.2 dB than single reflected mirrors with 2.1 dB. The average insertion losses of 16-channel arrayed waveguides with two single-reflection mirrors and with two double-reflection-mirrors were measured to be 6.1 and 4.4 dB for 6-cm-long waveguides at a wavelength of 830 nm, respectively. The crosstalk between the waveguides was less than -25 dB. The characteristics of the waveguide arrays are good enough for applications to optical interconnects.

Published in:

Lightwave Technology, Journal of  (Volume:22 ,  Issue: 3 )