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Delamination problems of UV-cured adhesive bonded optical fiber in V-groove for photonic packaging

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7 Author(s)
M. A. Uddin ; Dept. of Electron. Eng., City Univ. of Hong Kong, China ; H. P. Chan ; K. W. Lam ; Y. C. Chan
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In this letter, we investigated the origin of the interfacial delamination due to uneven curing of ultraviolet (UV) adhesive in the fixing process of a fiber on a V-groove. The analytical ray tracing technique is used to estimate the UV intensity at different locations along the adhesive-fiber interface. Consequently, the unexposed or shaded region in the adhesive layer is determined, through which the interfacial delamination as a result of the reliability test is predicted.

Published in:

IEEE Photonics Technology Letters  (Volume:16 ,  Issue: 4 )