By Topic

Delamination problems of UV-cured adhesive bonded optical fiber in V-groove for photonic packaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Uddin, M.A. ; Dept. of Electron. Eng., City Univ. of Hong Kong, China ; Chan, H.P. ; Lam, K.W. ; Chan, Y.C.
more authors

In this letter, we investigated the origin of the interfacial delamination due to uneven curing of ultraviolet (UV) adhesive in the fixing process of a fiber on a V-groove. The analytical ray tracing technique is used to estimate the UV intensity at different locations along the adhesive-fiber interface. Consequently, the unexposed or shaded region in the adhesive layer is determined, through which the interfacial delamination as a result of the reliability test is predicted.

Published in:

Photonics Technology Letters, IEEE  (Volume:16 ,  Issue: 4 )