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Room temperature wafer bonding by elastomeric polymer-supported cold welding

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3 Author(s)
Zhang, W.Y. ; Dept. of Electr. & Comput. Eng., Lehigh Univ., Bethlehem, PA, USA ; Ferguson, G.S. ; Tatic-Lucic, S.

Elastomer supported cold welding is applied as a wafer bonding technique. By placing the elastomeric polymer layer beneath the metal contact surfaces, two silicon wafers under limited load (∼ 3 KPa) at 25 °C. This method for room temperature wafer bonding without applying a voltage, high pressure, or vacuum is applicable for MEMS and NEMS packaging and fabrication processes.

Published in:

Semiconductor Device Research Symposium, 2003 International

Date of Conference:

10-12 Dec. 2003