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Boundary condition independent dynamic compact models of packages and heat sinks from thermal transient measurements

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5 Author(s)
Rencz, M. ; MicReD, Budapest, Hungary ; Farkas, G. ; Szekely, V. ; Poppe, A.
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In this paper a methodology developed for the generation of transient compact models of packages and heat sinks from measured thermal transient results is described. The main advantage of generating dynamic compact models solely from measured results is the time-gain: the lengthy transient simulations, suggested by the DELPHI methodology can be omitted. After summarizing the procedure of generating the compact models of packages and heat sinks from measurements the use of the obtained dynamic compact package models in board level simulators, extended with the feature of calculating with compact models is presented.

Published in:

Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)

Date of Conference:

10-12 Dec. 2003