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Capillary underfill and mold encapsulation materials for exposed die flip chip molded matrix array package with thin substrate

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7 Author(s)
Chee Choong Kooi ; Intel Technol., Penang, Malaysia ; Lim Szu Shing ; S. Periaman ; J. Chui
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This paper discusses the work on capillary underfill and mold technology to assemble exposed die backside Flip Chip Molded Matrix Array. Parts were successfully assembled and subjected to reliability stress test. The interaction between capillary underfill and mold compound materials are crucial for assembly and reliability performances of this configuration. Both materials need to be chemically and physically compatible to achieve high reliability performance.

Published in:

Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)

Date of Conference:

10-12 Dec. 2003