Cart (Loading....) | Create Account
Close category search window

Low cost wafer level packaging of MEMS devices [piezoresistive pressure sensor example]

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Iliescu, C. ; Inst. of Bioeng. & Nanotechnology, Singapore, Singapore ; Miao, Jianmin ; Tay, F.E.H.

This paper presents a packaging solution at wafer level for MEMS devices using silicon as packaging material and glass frit wafer-to-wafer bonding techniques for sealing. The MEMS devices wafer is bonded between two other silicon wafers. These cover wafers must assure the protection of the sensitive parts of MEMS devices and also the electrical and mechanical connection with PCB. For characterizing our wafer level packaging (WLP) solution we chose, as a test chip, a sensitive piezoresistive pressure sensor (operating range 0 to 0.4 bars). The main advantage of using this sensor is that the offset variation of the tensometric bridge, measured before and after the packaging, gives us the information on the residual stress induced by the packaging technique. Very good results were obtain; the variation of the tensometric bridge offset was less than 5 mV at a supply voltage of 5 V.

Published in:

Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)

Date of Conference:

10-12 Dec. 2003

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.