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Portable electronic products such as mobile phones are susceptible to drop impacts. Consequently, the effects of impact and shock on the integrity of the electronic components on a printed circuit board (PCB) are important mechanical reliability issues that need to be addressed, Mechanical shock tests for electronic components generally fall into two categories: board-level and product-level. The most realistic shock tests would be product-level tests on completed products. However, board-level tests simplify real-life drop impact scenarios. This paper provides insights into how comprehensive board-level testing is in duplicating the state of loading experienced by components in product level drop tests. The mechanical responses of PCBs in terms of impact force, acceleration and strains from both types of drop tests are examined and compared. These findings constitute the basis needed for future development of realistic board-level tests to replicate product-level tests.