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Delamination at the interface between a silicon backside and the die attach paste has been reported, and this delamination led to package cracking, resulting in reliability problems. In this paper, a series of experiments was conducted to investigate factors affecting the interfacial adhesion between the die back side and the attach paste of an integrated circuit (IC) package. Poor interfacial adhesion potentially leads to a delamination and crack at the interface. The aim is to understand better the interfacial adhesion phenomena, and possible failure mechanism(s) of a ball grid array (BGA) package with delamination/crack propagation between the die back side and the die attach paste.