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SPICE-compatible full-wave equivalent circuit model for interconnect structures

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2 Author(s)
See, K.Y. ; Nanyang Technol. Univ., Singapore, Singapore ; Chua, E.K.

This paper presents the development of a SPICE-compatible fall-wave equivalent circuit model for high-speed interconnect structures. By enforcing the necessary boundary conditions for the Maxwell's equations on the interconnect structures, the electric field integral equations (EFIEs) are formulated. Using the method of moments, the inductive and capacitive elements of the interconnect structure are extracted. Good agreement with the results obtained from an EM simulator is demonstrated.

Published in:

Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)

Date of Conference:

10-12 Dec. 2003