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Numerical Conformal Mapping for Treatment of Geometry Problems in Process Simulation

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2 Author(s)
Seidl, A. ; Institute fur Festkorpertechnologie, Munich, Germany ; Svoboda, M.

In semiconductor modeling, partial differential equations often have to be solved on a domain with a curved boundary. A numerical conformal mapping well suited for process modeling problems is presented. Its use in connection with a moving boundary is explained.

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Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:4 ,  Issue: 4 )