Scheduled System Maintenance on May 29th, 2015:
IEEE Xplore will be upgraded between 11:00 AM and 10:00 PM EDT. During this time there may be intermittent impact on performance. We apologize for any inconvenience.
By Topic

The effects of unsymmetric matrix permutations and scalings in semiconductor device and circuit simulation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Schenk, O. ; IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA ; Rollin, S. ; Gupta, A.

The solution of large sparse unsymmetric linear systems is a critical and challenging component of semiconductor device and circuit simulations. The time for a simulation is often dominated by this part. The sparse solver is expected to balance different, and often conflicting requirements. Reliability, a low memory-footprint, and a short solution time are a few of these demands. Currently, no black-box solver exists that can satisfy all criteria. The linear systems from both simulations can be highly ill-conditioned and are, therefore, quite challenging for direct and iterative methods. In this paper, it is shown that algorithms to place large entries on the diagonal using unsymmetric permutations and scalings greatly enhance the reliability of both direct and preconditioned iterative solvers for unsymmetric linear systems arising in semiconductor device and circuit simulations. The numerical experiments indicate that the overall solution strategy is both reliable and cost effective.

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:23 ,  Issue: 3 )