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Package design for high performance ICs

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1 Author(s)

This article deals about package design for high performance ICs. Product development for any high performance chip is a co-design process between a chip and a package designer. Wire bond packages have been developed using new design process. Flip chip design process was also been reviewed using a 1312GA package as a vehicle.

Published in:

Design, Automation and Test in Europe Conference and Exhibition, 2004. Proceedings  (Volume:3 )

Date of Conference:

16-20 Feb. 2004